Soitec announces appointment of Paul Boudre as Chief Operating Officer
BERNIN, France — May 27, 2008 — Soitec (Euronext Paris), the world’s leading supplier of silicon-on-insulator (SOI) wafers and other engineered substrates used in the microelectronics industry, has announced today that Paul Boudre has been appointed as the company’s new Chief Operating Officer (COO). Boudre most recently held the position of the company’s Executive Vice President of Sales, Marketing and Customer Support. As COO, he will report directly to André-Jacques Auberton-Hervé, president and CEO of the Soitec Group.
“Since joining Soitec last year, Paul Boudre has become a key member of our team. Now as COO, we will continue to benefit from his leadership and his deep understanding of the industry,” said Auberton-Hervé. “I am confident that the energy and vision he brings to this demanding position will be great assets to the company as we move forward together.”
Boudre joined Soitec’s executive team in January 2007 as a core member of the office of the president. Since then, he has been leading the company’s worldwide sales and marketing efforts, and expansion into new markets and applications. Most recently, the R&D organization moved under his responsibility to ensure closer alignment and long term partnership with strategic customers. In his new position as COO, he will continue these efforts, as well as overseeing industrial operations, supply chain management, and IT.
A semiconductor industry veteran of more than 20 years, Boudre first came to Soitec from KLA-Tencor, where he held the position of vice president and general manager for U.S. and Europe field operations, as well as vice president of the yield management group and field applications worldwide. Previous to that, he held management positions with IBM, STMicroelectronics, Motorola and Atmel.
Boudre holds a master’s degree in chemistry from France’s Ecole Nationale Superieure de Chimie de Toulouse.
About the Soitec Group:
The Soitec Group is the world’s leading innovator and provider of the engineered substrate solutions that serve as the foundation for today’s most advanced microelectronic products. The group leverages its proprietary Smart Cut™ technology to engineer new substrate solutions, such as silicon-on-insulator (SOI) wafers, which became the first high-volume application for this proprietary technology. Since then, SOI has emerged as the material platform of the future, enabling the production of higher performing, faster chips that consume less power.
Today, Soitec produces more than 80 percent of the world’s SOI wafers. Headquartered in Bernin, France, with two high-volume fabs on-site, Soitec has offices throughout the United States, Japan and Taiwan, and a new production site in the process of customers’ qualification in Singapore.
Two other divisions, Picogiga International (Les Ulis) and Tracit Technologies (Bernin), complete the Soitec Group. Picogiga focuses on delivering advanced substrates solutions, including III-Vs epiwafers and gallium nitride (GaN)-based wafers, to the compound material world for the manufacture of high-frequency electronics and other optoelectronic devices. Tracit, on the other hand, focuses on thin-film layer transfer technologies used to manufacture advanced substrates for power ICs and microsystems, as well as generic circuit transfer technology for applications such as image sensors and 3D-integration. Shares of the Soitec Group are listed on Euronext Paris.
Soitec, Smart Cut and UNIBOND are trademarks of S.O.I.TEC Silicon On Insulator Technologies.
Contact:
Camille Darnaud-Dufour, Vice President, Communications
Tel (France): +33 (0) 6 79 49 51 43
Email: camille.darnaud-dufour@soitec.com