The industry's standard: Smart Cut™, smart choice
The Soitec Group has a broad product portfolio based on a key technology: Smart Cut™
This technology is based on ion implantation, wafer bonding and atomic level splitting. Ion implantation weakens the silicon crystal at the desired depth. This acts as an atomic scalpel, lifting off a thin layer from the donor substrate and placing it onto a new base wafer of your choice.
This technology offers unique flexibility in terms of diameter, starting material and buried layer thicknesses and uniformities. The use of standard semiconductor manufacturing equipment allows high-volume production, process reproducibility, and consistent quality.
