In response to customer needs across a very broad range of IC industry segments, the Soitec Group complements its core Smart Cut™ technology with III-V expertise from Picogiga and wafer-level solutions from Tracit Technologies.

Speed improvement & better performance
• reduced junction capacitance
• floating body boost effect
• higher signal-to-noise ratio for RF & analog
Lower dynamic & static power consumption
• Vdd reduction
Yield & reliability
• enhanced isolation
• reduced susceptibility to electro-magnetic interface
• better signal linearity
Value to your critical technical & economic requirements
